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One-Step Device Fabrication of Phosphorene and Graphene Interdigital Micro-Supercapacitors with High Energy Density
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One-Step Device Fabrication of Phosphorene and Graphene Interdigital Micro-Supercapacitors with High Energy Density
Posted:2017-06-23 08:54    Column:2017
H. Xiao, Z.-S. Wu,* L. Chen, F. Zhou, S. H. Zheng, W. C. Ren,* H.-M. Cheng, X. H. Bao
ACS Nano 2017, 11(7): 7284–7292.
DOI: 10.1021/acsnano.7b03288 [PDF]
                              



Rational engineering and simplified fabrication of high-energy micro-supercapacitors (MSCs) using graphene and other 2D nanosheets are of great value for flexible and integrated electronics. Here we develop one-step mask-assisted simplified fabrication of high-energy MSCs (PG-MSCs) based on the interdigital hybrid electrode (PG) patterns of stacking high-quality phosphorene nanosheets and electrochemically exfoliated graphene in ionic liquid electrolyte. The hybrid PG films with interdigital patterns were directly manufactured by layer-by-layer deposition of phosphorene and graphene nanosheets with the assistance of a customized interdigital mask, and directly transferred onto a flexible substrate. The resultant patterned PG films present outstanding uniformity, flexibility, conductivity (319 S cm-1) and structural integration, which can directly serve as binder- and additive-free flexible electrodes for MSCs. Remarkably, PG-MSCs deliver remarkable energy density of 11.6 mWh cm-3, outperforming most nanocarbon-based MSCs. Moreover, our PG-MSCs show outstanding flexibility and stable performance with slightly capacitance fluctuation even under highly folded states. In addition, our simplified mask-assisted strategy for PG-MSCs is highly flexible for simplified production of parallel and serial interconnected modular power sources, without need of conventional metal-based interconnects and contacts, for designable integrated circuits with high output current and voltage.

Dalian Institute of Chemical Physics, CAS
457 Zhongshan Road Dalian, China 116023
E-mail: wuzs@dicp.ac.cn
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